H0402CUY824K20-W
vs
S0402CPX824K20
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
STATE OF THE ART INC
|
STATE OF THE ART INC
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Construction |
Chip
|
Chip
|
| JESD-609 Code |
e4
|
e0
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Package Height |
0.46 mm
|
0.46 mm
|
| Package Length |
1.07 mm
|
1.07 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
0.56 mm
|
0.56 mm
|
| Packing Method |
Waffle Pack
|
BULK
|
| Rated Power Dissipation (P) |
0.05 W
|
0.05 W
|
| Resistance |
820000 Ω
|
820000 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
0402
|
0402
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
200 ppm/°C
|
200 ppm/°C
|
| Terminal Finish |
Silver (Ag) - with Nickel (Ni) barrier
|
Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
|
| Tolerance |
10%
|
10%
|
| Working Voltage |
30 V
|
30 V
|
| Base Number Matches |
1
|
3
|
| Pbfree Code |
|
No
|
| Package Description |
|
CHIP
|
| HTS Code |
|
8533.21.00.30
|
| Mounting Feature |
|
SURFACE MOUNT
|
| Package Shape |
|
RECTANGULAR PACKAGE
|
| Rated Temperature |
|
70 °C
|
| Surface Mount |
|
YES
|
| Terminal Shape |
|
WRAPAROUND
|
|
|
|
Compare H0402CUY824K20-W with alternatives
Compare S0402CPX824K20 with alternatives