H0402CUY824K20-W vs H0402CUX824K20-W feature comparison

H0402CUY824K20-W State of the Art Inc

Buy Now Datasheet

H0402CUX824K20-W State of the Art Inc

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Active Active
Ihs Manufacturer STATE OF THE ART INC STATE OF THE ART INC
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
Construction Chip Chip
JESD-609 Code e4 e0
Number of Terminals 2 2
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -65 °C -65 °C
Package Height 0.46 mm 0.46 mm
Package Length 1.07 mm 1.07 mm
Package Style SMT SMT
Package Width 0.56 mm 0.56 mm
Packing Method Waffle Pack Waffle Pack
Rated Power Dissipation (P) 0.05 W 0.05 W
Resistance 820000 Ω 820000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0402 0402
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Finish Silver (Ag) - with Nickel (Ni) barrier Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
Tolerance 10% 10%
Working Voltage 30 V 30 V
Base Number Matches 1 1

Compare H0402CUY824K20-W with alternatives

Compare H0402CUX824K20-W with alternatives