H0302CPX8873F10 vs S0302CPX8873F10-W feature comparison

H0302CPX8873F10 State of the Art Inc

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S0302CPX8873F10-W State of the Art Inc

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Rohs Code No No
Part Life Cycle Code Active Active
Ihs Manufacturer STATE OF THE ART INC STATE OF THE ART INC
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
Construction Chip Chip
JESD-609 Code e0 e0
Number of Terminals 2 2
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -65 °C -65 °C
Package Height 0.38 mm 0.38 mm
Package Length 0.81 mm 0.81 mm
Package Style SMT SMT
Package Width 0.56 mm 0.56 mm
Packing Method Bulk WAFFLE PACK
Rated Power Dissipation (P) 0.04 W 0.04 W
Resistance 887000 Ω 887000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0302 0302
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
Tolerance 1% 1%
Working Voltage 15 V 15 V
Base Number Matches 1 1
Pbfree Code No
Package Description CHIP
HTS Code 8533.21.00.30
Mounting Feature SURFACE MOUNT
Package Shape RECTANGULAR PACKAGE
Rated Temperature 70 °C
Surface Mount YES
Terminal Shape WRAPAROUND

Compare H0302CPX8873F10 with alternatives

Compare S0302CPX8873F10-W with alternatives