H0302CPX1373F10-W
vs
S0302CPX1373F10
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
STATE OF THE ART INC
|
STATE OF THE ART INC
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
Construction |
Chip
|
Chip
|
JESD-609 Code |
e0
|
e0
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-65 °C
|
-65 °C
|
Package Height |
0.38 mm
|
0.38 mm
|
Package Length |
0.81 mm
|
0.81 mm
|
Package Style |
SMT
|
SMT
|
Package Width |
0.56 mm
|
0.56 mm
|
Packing Method |
Waffle Pack
|
BULK
|
Rated Power Dissipation (P) |
0.04 W
|
0.04 W
|
Resistance |
137000 Ω
|
137000 Ω
|
Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
Size Code |
0302
|
0302
|
Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
Temperature Coefficient |
100 ppm/°C
|
100 ppm/°C
|
Terminal Finish |
Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
|
Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
|
Tolerance |
1%
|
1%
|
Working Voltage |
15 V
|
15 V
|
Base Number Matches |
1
|
2
|
Pbfree Code |
|
No
|
Package Description |
|
CHIP
|
HTS Code |
|
8533.21.00.30
|
Mounting Feature |
|
SURFACE MOUNT
|
Package Shape |
|
RECTANGULAR PACKAGE
|
Rated Temperature |
|
70 °C
|
Surface Mount |
|
YES
|
Terminal Shape |
|
WRAPAROUND
|
|
|
|
Compare H0302CPX1373F10-W with alternatives
Compare S0302CPX1373F10 with alternatives