H0302CPG8873F10-W vs H0302CPX8873F10-W feature comparison

H0302CPG8873F10-W State of the Art Inc

Buy Now Datasheet

H0302CPX8873F10-W State of the Art Inc

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Active Active
Ihs Manufacturer STATE OF THE ART INC STATE OF THE ART INC
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
Construction Chip Chip
JESD-609 Code e4 e0
Number of Terminals 2 2
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -65 °C -65 °C
Package Height 0.38 mm 0.38 mm
Package Length 0.81 mm 0.81 mm
Package Style SMT SMT
Package Width 0.56 mm 0.56 mm
Packing Method Waffle Pack Waffle Pack
Rated Power Dissipation (P) 0.04 W 0.04 W
Resistance 887000 Ω 887000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0302 0302
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Gold (Au) Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
Tolerance 1% 1%
Working Voltage 15 V 15 V
Base Number Matches 1 1

Compare H0302CPG8873F10-W with alternatives

Compare H0302CPX8873F10-W with alternatives