H0302CPG8873F10-W
vs
H0302CPX8873F10-W
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Active
Active
Ihs Manufacturer
STATE OF THE ART INC
STATE OF THE ART INC
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
Construction
Chip
Chip
JESD-609 Code
e4
e0
Number of Terminals
2
2
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Height
0.38 mm
0.38 mm
Package Length
0.81 mm
0.81 mm
Package Style
SMT
SMT
Package Width
0.56 mm
0.56 mm
Packing Method
Waffle Pack
Waffle Pack
Rated Power Dissipation (P)
0.04 W
0.04 W
Resistance
887000 Ω
887000 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
0302
0302
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
100 ppm/°C
Terminal Finish
Gold (Au)
Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
Tolerance
1%
1%
Working Voltage
15 V
15 V
Base Number Matches
1
1
Compare H0302CPG8873F10-W with alternatives
Compare H0302CPX8873F10-W with alternatives