GXM-200B2.9V85C
vs
MCF5470VR200
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Not Recommended
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NXP SEMICONDUCTORS
Part Package Code
BGA
Package Description
BGA,
27 X 27 MM, MS-034AAL-1, PBGA-388
Pin Count
352
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
External Data Bus Width
32
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B352
S-PBGA-B388
Length
35 mm
27 mm
Low Power Mode
YES
YES
Number of Terminals
352
388
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.23 mm
2.55 mm
Speed
200 MHz
200 MHz
Supply Voltage-Max
3.05 V
1.58 V
Supply Voltage-Min
2.75 V
1.43 V
Supply Voltage-Nom
2.9 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
35 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
1
1
Rohs Code
ECCN Code
3A991.A.2
Factory Lead Time
13 Weeks
Samacsys Manufacturer
NXP
Clock Frequency-Max
66.66 MHz
JESD-609 Code
e1
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)
40
Compare GXM-200B2.9V85C with alternatives
Compare MCF5470VR200 with alternatives