GXM-200B2.9V70C vs MCF5485CZP200 feature comparison

GXM-200B2.9V70C Texas Instruments

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MCF5485CZP200 NXP Semiconductors

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Part Life Cycle Code Obsolete Not Recommended
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Part Package Code BGA
Package Description BGA, 27 X 27 MM, 1 MM PITCH, MS-034AAL-1, PBGA-388
Pin Count 352
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 32
Bit Size 32 32
Boundary Scan YES YES
External Data Bus Width 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B352 S-PBGA-B388
Length 35 mm 27 mm
Low Power Mode YES YES
Number of Terminals 352 388
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.23 mm 2.55 mm
Speed 200 MHz 200 MHz
Supply Voltage-Max 3.05 V 3.6 V
Supply Voltage-Min 2.75 V 3 V
Supply Voltage-Nom 2.9 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 1 1
Rohs Code No
ECCN Code 5A002.A.1
Factory Lead Time 13 Weeks
Samacsys Manufacturer NXP
Clock Frequency-Max 66.67 MHz
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Terminal Finish Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) 40

Compare GXM-200B2.9V70C with alternatives

Compare MCF5485CZP200 with alternatives