GXM-200B2.9V70C
vs
MCF5485CZP200
feature comparison
Part Life Cycle Code |
Obsolete
|
Not Recommended
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NXP SEMICONDUCTORS
|
Part Package Code |
BGA
|
|
Package Description |
BGA,
|
27 X 27 MM, 1 MM PITCH, MS-034AAL-1, PBGA-388
|
Pin Count |
352
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Additional Feature |
ALSO REQUIRES 3.3V SUPPLY
|
|
Address Bus Width |
32
|
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
External Data Bus Width |
32
|
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B352
|
S-PBGA-B388
|
Length |
35 mm
|
27 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
352
|
388
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.23 mm
|
2.55 mm
|
Speed |
200 MHz
|
200 MHz
|
Supply Voltage-Max |
3.05 V
|
3.6 V
|
Supply Voltage-Min |
2.75 V
|
3 V
|
Supply Voltage-Nom |
2.9 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
35 mm
|
27 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
No
|
ECCN Code |
|
5A002.A.1
|
Factory Lead Time |
|
13 Weeks
|
Samacsys Manufacturer |
|
NXP
|
Clock Frequency-Max |
|
66.67 MHz
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
260
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare GXM-200B2.9V70C with alternatives
Compare MCF5485CZP200 with alternatives