GX1-200B-85-1.8
vs
XPC8240LZU200E
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NXP SEMICONDUCTORS
Package Description
BGA-352
,
Reach Compliance Code
not_compliant
unknown
Address Bus Width
32
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
33 MHz
External Data Bus Width
32
Format
FLOATING POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B352
JESD-609 Code
e0
Length
35 mm
Low Power Mode
YES
Moisture Sensitivity Level
3
Number of Terminals
352
Operating Temperature-Max
85 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Equivalence Code
BGA352,26X26,50
Package Shape
SQUARE
Package Style
GRID ARRAY
Peak Reflow Temperature (Cel)
220
Qualification Status
Not Qualified
Seated Height-Max
2.23 mm
Speed
200 MHz
Supply Voltage-Max
1.89 V
Supply Voltage-Min
1.71 V
Supply Voltage-Nom
1.8 V
Surface Mount
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
Terminal Finish
TIN LEAD
Terminal Form
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
35 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
4
5
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01