GX1-200B-85-1.8
vs
MCF5484CVR200
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
FREESCALE SEMICONDUCTOR INC
Package Description
BGA-352
27 X 27 MM, 1 MM PITCH, MS-034AAL-1, PBGA-388
Reach Compliance Code
not_compliant
compliant
Address Bus Width
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
33 MHz
66.67 MHz
External Data Bus Width
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B352
S-PBGA-B388
JESD-609 Code
e0
e1
Length
35 mm
27 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of Terminals
352
388
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA352,26X26,50
BGA388,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
220
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.23 mm
2.55 mm
Speed
200 MHz
200 MHz
Supply Voltage-Max
1.89 V
3.6 V
Supply Voltage-Min
1.71 V
3 V
Supply Voltage-Nom
1.8 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
40
Width
35 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
4
3
Pbfree Code
Part Package Code
BGA
Pin Count
388
ECCN Code
5A992
HTS Code
8542.31.00.01
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