GWIXP455AAB
vs
GWIXP465AET
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
HBGA,
|
TBGA, BGA544,26X26,50
|
Pin Count |
544
|
544
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Additional Feature |
ALSO REQUIRES 3.3V SUPPLY
|
|
Address Bus Width |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
66 MHz
|
33.33 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B544
|
S-PBGA-B544
|
Length |
35 mm
|
35 mm
|
Low Power Mode |
NO
|
YES
|
Moisture Sensitivity Level |
1
|
|
Number of Terminals |
544
|
544
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HBGA
|
TBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, HEAT SINK/SLUG
|
GRID ARRAY, THIN PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.51 mm
|
1.17 mm
|
Speed |
266 MHz
|
33.33 MHz
|
Supply Voltage-Max |
1.365 V
|
3.465 V
|
Supply Voltage-Min |
1.235 V
|
3.135 V
|
Supply Voltage-Nom |
1.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
35 mm
|
35 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
Bit Size |
|
32
|
Package Equivalence Code |
|
BGA544,26X26,50
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare GWIXP455AAB with alternatives
Compare GWIXP465AET with alternatives