GUF30M
vs
HS3MB
feature comparison
| Part Life Cycle Code |
Contact Manufacturer
|
Active
|
| Ihs Manufacturer |
FIRST COMPONENTS INTERNATIONAL
|
TAIWAN SEMICONDUCTOR CO LTD
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.7 V
|
1.7 V
|
| Non-rep Pk Forward Current-Max |
150 A
|
100 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Operating Temperature-Max |
175 °C
|
150 °C
|
| Output Current-Max |
3 A
|
3 A
|
| Rep Pk Reverse Voltage-Max |
1000 V
|
1000 V
|
| Reverse Recovery Time-Max |
0.075 µs
|
0.075 µs
|
| Surface Mount |
NO
|
YES
|
| Base Number Matches |
2
|
4
|
| Rohs Code |
|
Yes
|
| Package Description |
|
SMB, 2 PIN
|
| HTS Code |
|
8541.10.00.80
|
| Samacsys Manufacturer |
|
Taiwan Semiconductor
|
| Additional Feature |
|
LOW POWER LOSS
|
| Application |
|
EFFICIENCY
|
| Diode Element Material |
|
SILICON
|
| JEDEC-95 Code |
|
DO-214AA
|
| JESD-30 Code |
|
R-PDSO-C2
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Number of Terminals |
|
2
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Qualification Status |
|
Not Qualified
|
| Reverse Current-Max |
|
10 µA
|
| Terminal Finish |
|
TIN
|
| Terminal Form |
|
C BEND
|
| Terminal Position |
|
DUAL
|
|
|
|
Compare GUF30M with alternatives
Compare HS3MB with alternatives