GTLP2T152MX
vs
CD74HC652H
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
HARRIS SEMICONDUCTOR
|
| Part Package Code |
SOIC
|
|
| Package Description |
0.150 INCH, MS-012, SOIC-8
|
DIE,
|
| Pin Count |
8
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Family |
GTLP
|
HC/UH
|
| JESD-30 Code |
R-PDSO-G8
|
X-XUUC-N24
|
| JESD-609 Code |
e3
|
|
| Length |
4.9 mm
|
|
| Logic IC Type |
BUS TRANSCEIVER
|
REGISTERED BUS TRANSCEIVER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
2
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
8
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
OPEN-DRAIN/3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
SOP
|
DIE
|
| Package Shape |
RECTANGULAR
|
UNSPECIFIED
|
| Package Style |
SMALL OUTLINE
|
UNCASED CHIP
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
7.3 ns
|
55 ns
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
|
| Supply Voltage-Max (Vsup) |
3.45 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
3.15 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
3.9 mm
|
|
| Base Number Matches |
2
|
2
|
| HTS Code |
|
8542.39.00.01
|
| Additional Feature |
|
SELECT INPUT FOR MULTIPLEXED TRANSMISSION OF REGISTERED/REAL TIME DATA
|
| Load Capacitance (CL) |
|
50 pF
|
| Package Equivalence Code |
|
DIE OR CHIP
|
|
|
|
Compare GTLP2T152MX with alternatives
Compare CD74HC652H with alternatives