GT28F800B3T120 vs AM29DL800BT120WBK feature comparison

GT28F800B3T120 Rochester Electronics LLC

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AM29DL800BT120WBK AMD

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS LLC ADVANCED MICRO DEVICES INC
Part Package Code BGA
Package Description CSP, MICRO, BGA-48
Pin Count 48
Reach Compliance Code unknown unknown
Access Time-Max 120 ns 120 ns
Additional Feature USER SELECTABLE 3V OR 12V VPP; TOP BOOT BLOCK
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e0
Length 7.91 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level NOT SPECIFIED
Number of Functions 1
Number of Terminals 48 48
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 512KX16 512KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA FBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 3 V
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 1 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES YES
Technology MOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 6.5 mm
Base Number Matches 2 2
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Alternate Memory Width 8
Boot Block TOP
Command User Interface YES
Data Polling YES
Number of Sectors/Size 2,4,2,14
Package Equivalence Code BGA48,6X8,32
Ready/Busy YES
Sector Size 16K,8K,32K,64K
Standby Current-Max 0.000005 A
Supply Current-Max 0.045 mA
Toggle Bit YES
Type NOR TYPE