GT28F128W18T70
vs
K8A6515EBC-HE7C0
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NUMONYX
SAMSUNG SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
0.75 MM PITCH, CSP, MICRO, BGA-56
TFBGA,
Pin Count
56
88
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
70 ns
70 ns
Additional Feature
ALSO SUPPORTS SYNCHRONOUS OPERATION
BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
Boot Block
TOP
BOTTOM
JESD-30 Code
R-PBGA-B56
R-PBGA-B88
Length
9 mm
11 mm
Memory Density
134217728 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
56
88
Number of Words
8388608 words
4194304 words
Number of Words Code
8000000
4000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-25 °C
Organization
8MX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
1.8 V
1.8 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1.1 mm
Supply Voltage-Max (Vsup)
1.95 V
1.95 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
NOR TYPE
Width
7.7 mm
8 mm
Base Number Matches
2
1
Supply Current-Max
0.07 mA
Compare GT28F128W18T70 with alternatives
Compare K8A6515EBC-HE7C0 with alternatives