GSIB1560-E3
vs
MT600
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
VISHAY SEMICONDUCTORS
|
MICROSEMI CORP
|
| Package Description |
R-PSFM-T4
|
HERMETIC SEALED PACKAGE-4
|
| Pin Count |
4
|
4
|
| Manufacturer Package Code |
CASE GSIB-5S
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Breakdown Voltage-Min |
600 V
|
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
BRIDGE, 4 ELEMENTS
|
BRIDGE, 4 ELEMENTS
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
BRIDGE RECTIFIER DIODE
|
BRIDGE RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.95 V
|
1.2 V
|
| JESD-30 Code |
R-PSFM-T4
|
O-MUPF-D4
|
| JESD-609 Code |
e3
|
e0
|
| Non-rep Pk Forward Current-Max |
300 A
|
200 A
|
| Number of Elements |
4
|
4
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
4
|
4
|
| Operating Temperature-Max |
150 °C
|
200 °C
|
| Operating Temperature-Min |
-55 °C
|
-65 °C
|
| Output Current-Max |
3.5 A
|
25 A
|
| Package Body Material |
PLASTIC/EPOXY
|
METAL
|
| Package Shape |
RECTANGULAR
|
ROUND
|
| Package Style |
FLANGE MOUNT
|
PRESS FIT
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Standard |
UL RECOGNIZED
|
|
| Rep Pk Reverse Voltage-Max |
600 V
|
600 V
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
SOLDER LUG
|
| Terminal Position |
SINGLE
|
UPPER
|
| Base Number Matches |
1
|
2
|
| Samacsys Manufacturer |
|
Microsemi Corporation
|
| Additional Feature |
|
LEAKAGE CURRENT IS NOT AT 25 DEG C
|
| Reverse Current-Max |
|
0.001 µA
|
|
|
|
Compare GSIB1560-E3 with alternatives
Compare MT600 with alternatives