We use Cookies to give you best experience on our website. By using our website and services, you expressly agree to the placement of our performance, functionality and advertising cookies. Please see our Privacy Policy for more information.

Register or Sign In

GS8672T18BE-300 vs GS8662T18BGD-300 feature comparison

GS8672T18BE-300 GSI Technology

Buy Now Datasheet

GS8662T18BGD-300 GSI Technology

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer GSI TECHNOLOGY GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description LBGA, BGA165,11X15,40 LBGA, BGA165,11X15,40
Pin Count 165 165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.B
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 12 Weeks 24 Weeks
Access Time-Max 0.45 ns 0.45 ns
Additional Feature PIPELINED ARCHITECTURE, LATE WRITE PIPELINED ARCHITECTURE, LATE WRITE
Clock Frequency-Max (fCLK) 300 MHz 300 MHz
I/O Type COMMON COMMON
JESD-30 Code R-PBGA-B165 R-PBGA-B165
Length 17 mm 15 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type DDR SRAM DDR SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4MX18 4MX18
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA165,11X15,40 BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.4 mm
Standby Voltage-Min 1.7 V 1.7 V
Supply Current-Max 0.89 mA 0.495 mA
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15 mm 13 mm
Base Number Matches 1 1
Pbfree Code Yes
JESD-609 Code e1
Moisture Sensitivity Level 3
Terminal Finish TIN SILVER COPPER
Memory » SRAMs
Memory » SRAMs

Compare GS8672T18BE-300 with alternatives

Compare GS8662T18BGD-300 with alternatives