GS8672Q36AGE-333T
vs
CY7C1565KV18-550BZXI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
GSI TECHNOLOGY
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
LBGA,
15 X 13 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
Pin Count
165
165
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
0.45 ns
0.45 ns
Additional Feature
PIPELINED ARCHITECTURE
PIPELINED ARCHITECTURE
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
Length
17 mm
15 mm
Memory Density
75497472 bit
75497472 bit
Memory IC Type
STANDARD SRAM
QDR SRAM
Memory Width
36
36
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
2MX36
2MX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.5 mm
1.4 mm
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
15 mm
13 mm
Base Number Matches
1
1
Rohs Code
Clock Frequency-Max (fCLK)
550 MHz
I/O Type
SEPARATE
JESD-609 Code
e1
Moisture Sensitivity Level
3
Output Characteristics
3-STATE
Package Equivalence Code
BGA165,11X15,40
Peak Reflow Temperature (Cel)
260
Standby Current-Max
0.38 A
Standby Voltage-Min
1.7 V
Supply Current-Max
1.31 mA
Terminal Finish
TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s)
20
Compare GS8672Q36AGE-333T with alternatives
Compare CY7C1565KV18-550BZXI with alternatives