GS8672D18BGE-300T vs CY7C1513KV18-300BZXC feature comparison

GS8672D18BGE-300T GSI Technology

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CY7C1513KV18-300BZXC Infineon Technologies AG

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete End Of Life
Ihs Manufacturer GSI TECHNOLOGY INFINEON TECHNOLOGIES AG
Part Package Code BGA
Package Description LBGA, BGA165,11X15,40 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Pin Count 165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 0.45 ns 0.45 ns
Additional Feature PIPELINE ARCHITECTURE PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 300 MHz 300 MHz
I/O Type SEPARATE SEPARATE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
Length 17 mm 15 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type STANDARD SRAM QDR SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4MX18 4MX18
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA165,11X15,40 BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.4 mm
Standby Voltage-Min 1.7 V 1.7 V
Supply Current-Max 1.1 mA 0.57 mA
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 20
Width 15 mm 13 mm
Base Number Matches 1 2
Factory Lead Time 4 Weeks
JESD-609 Code e1
Moisture Sensitivity Level 3
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)

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