GS8662TT10BGD-450IT
vs
UPD44644092AF5-E33-FQ1-A
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
GSI TECHNOLOGY
RENESAS ELECTRONICS CORP
Part Package Code
BGA
BGA
Package Description
LBGA, BGA165,11X15,40
LBGA, BGA165,11X15,40
Pin Count
165
165
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
0.45 ns
0.45 ns
Additional Feature
PIPELINED ARCHITECTURE, LATE WRITE
Clock Frequency-Max (fCLK)
450 MHz
300 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
JESD-609 Code
e1
Length
15 mm
17 mm
Memory Density
75497472 bit
75497472 bit
Memory IC Type
DDR SRAM
DDR SRAM
Memory Width
9
9
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
8MX9
8MX9
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA165,11X15,40
BGA165,11X15,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.46 mm
Standby Current-Max
0.27 A
0.37 A
Standby Voltage-Min
1.7 V
1.7 V
Supply Current-Max
0.705 mA
0.49 mA
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
MOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
13 mm
15 mm
Base Number Matches
1
1
Compare GS8662TT10BGD-450IT with alternatives
Compare UPD44644092AF5-E33-FQ1-A with alternatives