GS8662R36BGD-300 vs CY7C1520V18-300BZC feature comparison

GS8662R36BGD-300 GSI Technology

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CY7C1520V18-300BZC Cypress Semiconductor

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer GSI TECHNOLOGY CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description LBGA, BGA165,11X15,40 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Pin Count 165 165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.B 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 24 Weeks
Access Time-Max 0.45 ns 0.45 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 300 MHz 300 MHz
I/O Type COMMON COMMON
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e1 e0
Length 15 mm 17 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type STANDARD SRAM DDR SRAM
Memory Width 36 36
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2MX36 2MX36
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA165,11X15,40 BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Standby Voltage-Min 1.7 V 1.7 V
Supply Current-Max 0.625 mA 0.9 mA
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 15 mm
Base Number Matches 1 1
Peak Reflow Temperature (Cel) 220

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