GS8662Q36BD-300M vs IS61QDB22M36A-300B4LI feature comparison

GS8662Q36BD-300M GSI Technology

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IS61QDB22M36A-300B4LI Integrated Silicon Solution Inc

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Rohs Code No
Part Life Cycle Code Active Active
Ihs Manufacturer GSI TECHNOLOGY INTEGRATED SILICON SOLUTION INC
Package Description LBGA, LBGA,
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.B 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 24 Weeks
Samacsys Manufacturer GSI TECHNOLOGY
Access Time-Max 0.45 ns 0.45 ns
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e0
Length 15 mm 15 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type QDR SRAM QDR SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 2MX36 2MX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Seated Height-Max 1.4 mm 1.4 mm
Supply Voltage-Max (Vsup) 1.9 V 1.89 V
Supply Voltage-Min (Vsup) 1.7 V 1.71 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 13 mm 13 mm
Base Number Matches 1 1
Part Package Code BGA
Pin Count 165
Additional Feature PIPELINED ARCHITECTURE
Moisture Sensitivity Level 3

Compare GS8662Q36BD-300M with alternatives

Compare IS61QDB22M36A-300B4LI with alternatives