GS8662Q10BGD-300T
vs
CY7C1557V18-300BZXC
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
GSI TECHNOLOGY
|
CYPRESS SEMICONDUCTOR CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
LBGA, BGA165,11X15,40
|
LBGA, BGA165,11X15,40
|
Pin Count |
165
|
165
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
0.45 ns
|
0.45 ns
|
Additional Feature |
PIPELINED ARCHITECTURE
|
PIPELINED ARCHITECTURE
|
Clock Frequency-Max (fCLK) |
300 MHz
|
300 MHz
|
I/O Type |
SEPARATE
|
COMMON
|
JESD-30 Code |
R-PBGA-B165
|
R-PBGA-B165
|
JESD-609 Code |
e1
|
e1
|
Length |
15 mm
|
17 mm
|
Memory Density |
75497472 bit
|
75497472 bit
|
Memory IC Type |
DDR SRAM
|
DDR SRAM
|
Memory Width |
9
|
9
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
165
|
165
|
Number of Words |
8388608 words
|
8388608 words
|
Number of Words Code |
8000000
|
8000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
8MX9
|
8MX9
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA165,11X15,40
|
BGA165,11X15,40
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.4 mm
|
1.4 mm
|
Standby Current-Max |
0.255 A
|
0.45 A
|
Standby Voltage-Min |
1.7 V
|
1.7 V
|
Supply Current-Max |
0.85 mA
|
1.1 mA
|
Supply Voltage-Max (Vsup) |
1.9 V
|
1.9 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN SILVER COPPER
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
13 mm
|
15 mm
|
Base Number Matches |
1
|
1
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare GS8662Q10BGD-300T with alternatives
Compare CY7C1557V18-300BZXC with alternatives