GS8662DT06BD-400 vs GS8662D08GE-200T feature comparison

GS8662DT06BD-400 GSI Technology

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GS8662D08GE-200T GSI Technology

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Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer GSI TECHNOLOGY GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description LBGA, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
Pin Count 165 165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.B 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 24 Weeks
Access Time-Max 0.45 ns 0.45 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
Length 15 mm 17 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type QDR SRAM DDR SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 8MX8 8MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Seated Height-Max 1.4 mm 1.5 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 13 mm 15 mm
Base Number Matches 1 1
Pbfree Code Yes
Clock Frequency-Max (fCLK) 200 MHz
I/O Type SEPARATE
JESD-609 Code e1
Moisture Sensitivity Level 3
Output Characteristics 3-STATE
Package Equivalence Code BGA165,11X15,40
Qualification Status Not Qualified
Standby Voltage-Min 1.7 V
Supply Current-Max 0.65 mA
Terminal Finish TIN SILVER COPPER

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