GS8662D36E-300 vs CY7C1515JV18-300BZC feature comparison

GS8662D36E-300 GSI Technology

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CY7C1515JV18-300BZC Cypress Semiconductor

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No
No No
Obsolete Obsolete
GSI TECHNOLOGY CYPRESS SEMICONDUCTOR CORP
BGA BGA
15 X 17 MM, 1 MM PITCH, FPBGA-165 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
165 165
compliant not_compliant
3A991.B.2.A 3A991.B.2.A
8542.32.00.41 8542.32.00.41
0.45 ns 0.45 ns
PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
300 MHz 300 MHz
SEPARATE SEPARATE
R-PBGA-B165 R-PBGA-B165
17 mm 17 mm
75497472 bit 75497472 bit
DDR SRAM QDR SRAM
36 36
3 3
1 1
165 165
2097152 words 2097152 words
2000000 2000000
SYNCHRONOUS SYNCHRONOUS
70 °C 70 °C
2MX36 2MX36
3-STATE 3-STATE
PLASTIC/EPOXY PLASTIC/EPOXY
LBGA LBGA
BGA165,11X15,40 BGA165,11X15,40
RECTANGULAR RECTANGULAR
GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
PARALLEL PARALLEL
235
Not Qualified Not Qualified
1.5 mm 1.4 mm
1.7 V 1.7 V
0.95 mA 1.14 mA
1.9 V 1.9 V
1.7 V 1.7 V
1.8 V 1.8 V
YES YES
CMOS CMOS
COMMERCIAL COMMERCIAL
BALL BALL
1 mm 1 mm
BOTTOM BOTTOM
15 mm 15 mm
1 2

Compare GS8662D36E-300 with alternatives

Compare CY7C1515JV18-300BZC with alternatives