We use Cookies to give you best experience on our website. By using our website and services, you expressly agree to the placement of our performance, functionality and advertising cookies. Please see our Privacy Policy for more information.

Register or Sign In

GS8662D36E-250 vs CY7C1515JV18-250BZC feature comparison

GS8662D36E-250 GSI Technology

Buy Now Datasheet

CY7C1515JV18-250BZC Cypress Semiconductor

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GSI TECHNOLOGY CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description 15 X 17 MM, 1 MM PITCH, FPBGA-165 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Pin Count 165 165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 0.45 ns 0.45 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 250 MHz 250 MHz
I/O Type SEPARATE SEPARATE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
Length 17 mm 17 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type DDR SRAM QDR SRAM
Memory Width 36 36
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2MX36 2MX36
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA165,11X15,40 BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 235 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.4 mm
Standby Voltage-Min 1.7 V 1.7 V
Supply Current-Max 0.85 mA 1.04 mA
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 15 mm 15 mm
Base Number Matches 1 1
JESD-609 Code e0
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Memory » SRAMs
Memory » SRAMs

Compare GS8662D36E-250 with alternatives

Compare CY7C1515JV18-250BZC with alternatives