GS8662D18E-300
vs
IS61QDB44M18A-300B3
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
GSI TECHNOLOGY
INTEGRATED SILICON SOLUTION INC
Part Package Code
BGA
Package Description
15 X 17 MM, 1 MM PITCH, FPBGA-165
13 X 15 MM, 1.20 MM HEIGHT, TFBGA-165
Pin Count
165
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
0.45 ns
0.45 ns
Additional Feature
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
300 MHz
300 MHz
I/O Type
SEPARATE
SEPARATE
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
Length
17 mm
15 mm
Memory Density
75497472 bit
75497472 bit
Memory IC Type
DDR SRAM
QDR SRAM
Memory Width
18
18
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
4MX18
4MX18
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
TBGA
Package Equivalence Code
BGA165,11X15,40
BGA165,11X15,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
235
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.5 mm
1.2 mm
Standby Voltage-Min
1.7 V
1.7 V
Supply Current-Max
0.875 mA
0.7 mA
Supply Voltage-Max (Vsup)
1.9 V
1.89 V
Supply Voltage-Min (Vsup)
1.7 V
1.71 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
15 mm
13 mm
Base Number Matches
1
1
Compare GS8662D18E-300 with alternatives
Compare IS61QDB44M18A-300B3 with alternatives