GS8644V72GC-200IT
vs
CY7C1474V33-200BGXC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
GSI TECHNOLOGY
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
LBGA,
14 X 22 MM, 1.76 MM HEIGHT, LEAD FREE, FBGA-209
Pin Count
209
209
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
6.5 ns
3 ns
Additional Feature
PIPELINED OR FLOW-THROUGH ARCHITECTURE
PIPELINED ARCHITECTURE
JESD-30 Code
R-PBGA-B209
R-PBGA-B209
JESD-609 Code
e1
e1
Length
22 mm
22 mm
Memory Density
75497472 bit
75497472 bit
Memory IC Type
CACHE SRAM
ZBT SRAM
Memory Width
72
72
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
209
209
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
1MX72
1MX72
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
1.96 mm
Supply Voltage-Max (Vsup)
2 V
3.63 V
Supply Voltage-Min (Vsup)
1.6 V
3.135 V
Supply Voltage-Nom (Vsup)
1.8 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
14 mm
Base Number Matches
1
1
Clock Frequency-Max (fCLK)
200 MHz
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
BGA209,11X19,40
Standby Voltage-Min
3.14 V
Time@Peak Reflow Temperature-Max (s)
20
Compare GS8644V72GC-200IT with alternatives
Compare CY7C1474V33-200BGXC with alternatives