GS8642Z72C-300I
vs
CY7C1474BV25-200BGI
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
GSI TECHNOLOGY
|
CYPRESS SEMICONDUCTOR CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
LBGA, BGA209,11X19,40
|
14 X 22 MM, 1.76 MM HEIGHT, FBGA-209
|
Pin Count |
209
|
209
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
3A991.B.2.B
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Factory Lead Time |
24 Weeks
|
|
Access Time-Max |
5.5 ns
|
3 ns
|
Additional Feature |
FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY
|
PIPELINED ARCHITECTURE
|
Clock Frequency-Max (fCLK) |
300 MHz
|
200 MHz
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
R-PBGA-B209
|
R-PBGA-B209
|
Length |
22 mm
|
22 mm
|
Memory Density |
75497472 bit
|
75497472 bit
|
Memory IC Type |
ZBT SRAM
|
ZBT SRAM
|
Memory Width |
72
|
72
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
209
|
209
|
Number of Words |
1048576 words
|
1048576 words
|
Number of Words Code |
1000000
|
1000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
1MX72
|
1MX72
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
BGA
|
Package Equivalence Code |
BGA209,11X19,40
|
BGA209,11X19,40
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
220
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.7 mm
|
1.96 mm
|
Standby Current-Max |
0.12 A
|
|
Standby Voltage-Min |
2.3 V
|
2.38 V
|
Supply Current-Max |
0.54 mA
|
0.45 mA
|
Supply Voltage-Max (Vsup) |
2.7 V
|
2.625 V
|
Supply Voltage-Min (Vsup) |
2.3 V
|
2.375 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
14 mm
|
14 mm
|
Base Number Matches |
1
|
2
|
|
|
|
Compare GS8642Z72C-300I with alternatives
Compare CY7C1474BV25-200BGI with alternatives