GS8642Z36B-167IV vs GS8644ZV36B-225IT feature comparison

GS8642Z36B-167IV GSI Technology

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GS8644ZV36B-225IT GSI Technology

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer GSI TECHNOLOGY GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description BGA, BGA,
Pin Count 119 119
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.B 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 24 Weeks
Access Time-Max 8 ns 6.5 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY PIPELINED OR FLOW-THROUGH ARCHITECTURE
JESD-30 Code R-PBGA-B119 R-PBGA-B119
JESD-609 Code e0 e0
Length 22 mm 22 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type ZBT SRAM ZBT SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX36 2MX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.99 mm 1.99 mm
Supply Voltage-Max (Vsup) 2 V 2 V
Supply Voltage-Min (Vsup) 1.7 V 1.6 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 2 1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 220

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Compare GS8644ZV36B-225IT with alternatives