GS8642V36F-300 vs K7N641845M-PI160 feature comparison

GS8642V36F-300 GSI Technology

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K7N641845M-PI160 Samsung Semiconductor

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GSI TECHNOLOGY SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA QFP
Package Description BGA, LQFP, QFP100,.63X.87
Pin Count 165 100
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 5.5 ns 3.5 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B165 R-PQFP-G100
Memory Density 75497472 bit 75497472 bit
Memory IC Type CACHE SRAM ZBT SRAM
Memory Width 36 18
Moisture Sensitivity Level 3 2
Number of Functions 1 1
Number of Terminals 165 100
Number of Words 2097152 words 4194304 words
Number of Words Code 2000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 2MX36 4MX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LQFP
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 235
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 2 V 2.625 V
Supply Voltage-Min (Vsup) 1.6 V 2.375 V
Supply Voltage-Nom (Vsup) 1.8 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL GULL WING
Terminal Position BOTTOM QUAD
Base Number Matches 4 1
Clock Frequency-Max (fCLK) 166 MHz
I/O Type COMMON
Length 20 mm
Output Characteristics 3-STATE
Package Equivalence Code QFP100,.63X.87
Seated Height-Max 1.6 mm
Standby Voltage-Min 2.38 V
Terminal Pitch 0.65 mm
Width 14 mm

Compare GS8642V36F-300 with alternatives

Compare K7N641845M-PI160 with alternatives