GS8641ZV18F-300
vs
GS864218GE-300T
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
GSI TECHNOLOGY
|
GSI TECHNOLOGY
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA,
|
BGA,
|
| Pin Count |
165
|
165
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
5.5 ns
|
5.5 ns
|
| Additional Feature |
FLOW-THROUGH OR PIPELINED ARCHITECTURE
|
FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY
|
| JESD-30 Code |
R-PBGA-B165
|
R-PBGA-B165
|
| Memory Density |
75497472 bit
|
75497472 bit
|
| Memory IC Type |
ZBT SRAM
|
CACHE SRAM
|
| Memory Width |
18
|
18
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
165
|
165
|
| Number of Words |
4194304 words
|
4194304 words
|
| Number of Words Code |
4000000
|
4000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
4MX18
|
4MX18
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
235
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
2 V
|
2.7 V
|
| Supply Voltage-Min (Vsup) |
1.6 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Base Number Matches |
1
|
1
|
| JESD-609 Code |
|
e1
|
| Length |
|
17 mm
|
| Terminal Finish |
|
TIN SILVER COPPER
|
| Terminal Pitch |
|
1 mm
|
| Width |
|
15 mm
|
|
|
|
Compare GS8641ZV18F-300 with alternatives
Compare GS864218GE-300T with alternatives