GS8641E36GF-300IT
vs
CY7C1480BV33-250BZXC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
GSI TECHNOLOGY
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
BGA,
15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
Pin Count
165
165
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
5.5 ns
3 ns
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY
PIPELINED ARCHITECTURE
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
JESD-609 Code
e1
e1
Memory Density
75497472 bit
75497472 bit
Memory IC Type
CACHE SRAM
CACHE SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
2MX36
2MX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
2.7 V
3.6 V
Supply Voltage-Min (Vsup)
2.3 V
3.135 V
Supply Voltage-Nom (Vsup)
2.5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
1
2
Clock Frequency-Max (fCLK)
250 MHz
I/O Type
COMMON
Length
17 mm
Output Characteristics
3-STATE
Package Equivalence Code
BGA165,11X15,40
Seated Height-Max
1.4 mm
Standby Voltage-Min
3.14 V
Supply Current-Max
0.5 mA
Terminal Pitch
1 mm
Time@Peak Reflow Temperature-Max (s)
20
Width
15 mm
Compare GS8641E36GF-300IT with alternatives
Compare CY7C1480BV33-250BZXC with alternatives