GS8640E36GT-250IV vs GS8641E36GF-300I feature comparison

GS8640E36GT-250IV GSI Technology

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GS8641E36GF-300I GSI Technology

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer GSI TECHNOLOGY GSI TECHNOLOGY
Part Package Code QFP BGA
Package Description LQFP, BGA,
Pin Count 100 165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.B 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 24 Weeks
Access Time-Max 6.5 ns 5.5 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY
JESD-30 Code R-PQFP-G100 R-PBGA-B165
JESD-609 Code e3 e1
Length 20 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type CACHE SRAM CACHE SRAM
Memory Width 36 36
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 100 165
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX36 2MX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm
Supply Voltage-Max (Vsup) 2 V 2.7 V
Supply Voltage-Min (Vsup) 1.7 V 2.3 V
Supply Voltage-Nom (Vsup) 1.8 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN TIN SILVER COPPER
Terminal Form GULL WING BALL
Terminal Pitch 0.65 mm
Terminal Position QUAD BOTTOM
Width 14 mm
Base Number Matches 1 1

Compare GS8640E36GT-250IV with alternatives

Compare GS8641E36GF-300I with alternatives