GS8640E18T-250T
vs
CY7C1482V33-167BZI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
GSI TECHNOLOGY
CYPRESS SEMICONDUCTOR CORP
Part Package Code
QFP
BGA
Package Description
LQFP,
15 X 17 MM, 1.40 MM HEIGHT, FBGA-165
Pin Count
100
165
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
6.5 ns
3.4 ns
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE
PIPELINED ARCHITECTURE
JESD-30 Code
R-PQFP-G100
R-PBGA-B165
Length
22 mm
17 mm
Memory Density
75497472 bit
75497472 bit
Memory IC Type
CACHE SRAM
CACHE SRAM
Memory Width
18
18
Number of Functions
1
1
Number of Terminals
100
165
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
4MX18
4MX18
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
220
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.45 mm
1.4 mm
Supply Voltage-Max (Vsup)
2.7 V
3.6 V
Supply Voltage-Min (Vsup)
2.3 V
3.135 V
Supply Voltage-Nom (Vsup)
2.5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
GULL WING
BALL
Terminal Pitch
0.65 mm
1 mm
Terminal Position
QUAD
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
14 mm
15 mm
Base Number Matches
1
1
Clock Frequency-Max (fCLK)
167 MHz
I/O Type
COMMON
JESD-609 Code
e0
Moisture Sensitivity Level
3
Output Characteristics
3-STATE
Package Equivalence Code
BGA165,11X15,40
Standby Voltage-Min
3.14 V
Terminal Finish
TIN LEAD
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Compare CY7C1482V33-167BZI with alternatives