GS8330DW72C-200I vs K7N327245M-HC22 feature comparison

GS8330DW72C-200I GSI Technology

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K7N327245M-HC22 Samsung Semiconductor

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GSI TECHNOLOGY SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description BGA, BGA, BGA209,11X19,40
Pin Count 209 209
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 2.25 ns 2.8 ns
Additional Feature PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B209 R-PBGA-B209
Length 22 mm 22 mm
Memory Density 37748736 bit 37748736 bit
Memory IC Type STANDARD SRAM ZBT SRAM
Memory Width 72 72
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 209 209
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512KX72 512KX72
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 220
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 1.95 V 2.625 V
Supply Voltage-Min (Vsup) 1.7 V 2.375 V
Supply Voltage-Nom (Vsup) 1.8 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 1
Clock Frequency-Max (fCLK) 227 MHz
I/O Type COMMON
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code BGA209,11X19,40
Seated Height-Max 2.2 mm
Standby Current-Max 0.01 A
Standby Voltage-Min 2.38 V
Terminal Finish TIN LEAD

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