GS8322V72C-225 vs CY7C1465AV33-100BGI feature comparison

GS8322V72C-225 GSI Technology

Buy Now Datasheet

CY7C1465AV33-100BGI Cypress Semiconductor

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GSI TECHNOLOGY CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description LBGA, 14 X 22 MM, 1.76 MM HEIGHT, FBGA-209
Pin Count 209 209
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 7 ns 8.5 ns
Additional Feature PIPELINED OR FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE
JESD-30 Code R-PBGA-B209 R-PBGA-B209
Length 22 mm 22 mm
Memory Density 37748736 bit 37748736 bit
Memory IC Type CACHE SRAM ZBT SRAM
Memory Width 72 72
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 209 209
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 512KX72 512KX72
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 220
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.96 mm
Supply Voltage-Max (Vsup) 2 V 3.6 V
Supply Voltage-Min (Vsup) 1.6 V 3.135 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 1
Clock Frequency-Max (fCLK) 100 MHz
I/O Type COMMON
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code BGA209,11X19,40
Standby Current-Max 0.12 A
Standby Voltage-Min 3.14 V
Terminal Finish TIN LEAD

Compare GS8322V72C-225 with alternatives

Compare CY7C1465AV33-100BGI with alternatives