GS832272C-250IV
vs
CY7C1464AV25-200BGI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
GSI TECHNOLOGY
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
LBGA,
14 X 22 MM, 1.76 MM HEIGHT, FBGA-209
Pin Count
209
209
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.B
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Factory Lead Time
24 Weeks
Access Time-Max
6.5 ns
3.2 ns
Additional Feature
FLOW-THROUGH OR PIELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY
PIPELINED ARCHITECTURE
JESD-30 Code
R-PBGA-B209
R-PBGA-B209
Length
22 mm
22 mm
Memory Density
37748736 bit
37748736 bit
Memory IC Type
CACHE SRAM
ZBT SRAM
Memory Width
72
72
Number of Functions
1
1
Number of Terminals
209
209
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
512KX72
512KX72
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
1.96 mm
Supply Voltage-Max (Vsup)
2 V
2.625 V
Supply Voltage-Min (Vsup)
1.7 V
2.375 V
Supply Voltage-Nom (Vsup)
1.8 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
14 mm
14 mm
Base Number Matches
1
1
Clock Frequency-Max (fCLK)
200 MHz
I/O Type
COMMON
JESD-609 Code
e0
Output Characteristics
3-STATE
Package Equivalence Code
BGA209,11X19,40
Standby Current-Max
0.12 A
Standby Voltage-Min
2.38 V
Supply Current-Max
0.385 mA
Terminal Finish
TIN LEAD
Compare GS832272C-250IV with alternatives
Compare CY7C1464AV25-200BGI with alternatives