GS832236AB-375
vs
WED2ZL236512S42BC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
GSI TECHNOLOGY
WHITE MICROELECTRONICS
Part Package Code
BGA
Package Description
BGA, BGA119,7X17,50
BGA-119
Pin Count
119
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.B
HTS Code
8542.32.00.41
Factory Lead Time
24 Weeks
Access Time-Max
4.2 ns
4.2 ns
Additional Feature
ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH
Clock Frequency-Max (fCLK)
375 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B119
R-PBGA-B119
JESD-609 Code
e0
Length
22 mm
Memory Density
37748736 bit
37748736 bit
Memory IC Type
STANDARD SRAM
SRAM MODULE
Memory Width
36
36
Number of Functions
1
1
Number of Terminals
119
119
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1MX36
1MX36
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA119,7X17,50
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.99 mm
Standby Current-Max
0.03 A
Standby Voltage-Min
2.3 V
Supply Current-Max
0.34 mA
Supply Voltage-Max (Vsup)
2.7 V
2.625 V
Supply Voltage-Min (Vsup)
2.3 V
2.375 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
Base Number Matches
1
2
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