GS832218E-150V
vs
GS832218GE-150V
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
GSI TECHNOLOGY
GSI TECHNOLOGY
Part Package Code
BGA
BGA
Package Description
LBGA,
LBGA,
Pin Count
165
165
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
8.5 ns
8.5 ns
Additional Feature
FLOW-THROUGH OR PIELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY
FLOW-THROUGH OR PIELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
Length
17 mm
17 mm
Memory Density
37748736 bit
37748736 bit
Memory IC Type
CACHE SRAM
CACHE SRAM
Memory Width
18
18
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2MX18
2MX18
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.5 mm
1.5 mm
Supply Voltage-Max (Vsup)
2 V
2 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15 mm
15 mm
Base Number Matches
1
1
JESD-609 Code
e1
Moisture Sensitivity Level
3
Terminal Finish
TIN SILVER COPPER
Compare GS832218E-150V with alternatives
Compare GS832218GE-150V with alternatives