GS8321ZV32GE-250T vs MT55L1MY32FF-11 feature comparison

GS8321ZV32GE-250T GSI Technology

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MT55L1MY32FF-11 Micron Technology Inc

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GSI TECHNOLOGY MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description LBGA, TBGA,
Pin Count 165 165
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 6.5 ns 8.5 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH ARCHITECTURE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e1 e1
Length 17 mm 17 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type ZBT SRAM ZBT SRAM
Memory Width 32 32
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX32 1MX32
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA TBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.2 mm
Supply Voltage-Max (Vsup) 2 V 3.465 V
Supply Voltage-Min (Vsup) 1.6 V 3.135 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 15 mm 15 mm
Base Number Matches 1 1

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Compare MT55L1MY32FF-11 with alternatives