GS8321E32AD-333IV vs GS8321E32AGD-333V feature comparison

GS8321E32AD-333IV GSI Technology

Buy Now Datasheet

GS8321E32AGD-333V GSI Technology

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Active Active
Ihs Manufacturer GSI TECHNOLOGY GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description LBGA, LBGA,
Pin Count 165 165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.B 3A991.B.2.B
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 24 Weeks 24 Weeks
Samacsys Manufacturer GSI TECHNOLOGY
Access Time-Max 5 ns 5 ns
Additional Feature ALSO OPERATES AT 2.5 V SUPPLY; PIPELINE MODE ALSO OPERATES AT 2.5 V SUPPLY; PIPELINE MODE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e0 e1
Length 15 mm 15 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type CACHE SRAM CACHE SRAM
Memory Width 32 32
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Organization 1MX32 1MX32
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Supply Voltage-Max (Vsup) 2 V 2 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 13 mm 13 mm
Base Number Matches 2 2
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Operating Temperature-Min
Temperature Grade OTHER

Compare GS8321E32AD-333IV with alternatives

Compare GS8321E32AGD-333V with alternatives