GS832132AD-250
vs
GS832132AD-150V
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
GSI TECHNOLOGY
GSI TECHNOLOGY
Part Package Code
BGA
BGA
Package Description
LBGA, BGA165,11X15,40
LBGA,
Pin Count
165
165
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.B
3A991.B.2.B
HTS Code
8542.32.00.41
8542.32.00.41
Factory Lead Time
24 Weeks
24 Weeks
Access Time-Max
5.5 ns
7.5 ns
Additional Feature
PIPELINE OR FLOW THROUGH ARCHITECTUREL; ALSO OPERATES AT 3.3 V SUPPLY
PIPELINE OR FLOW THROUGH ARCHITECTURE; ALSO OPERATES AT 2.5 SUPPLY
Clock Frequency-Max (fCLK)
250 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
Length
15 mm
15 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
CACHE SRAM
CACHE SRAM
Memory Width
32
32
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
1MX32
1MX32
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA165,11X15,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.4 mm
Standby Current-Max
0.03 A
Standby Voltage-Min
2.3 V
Supply Current-Max
0.26 mA
Supply Voltage-Max (Vsup)
2.7 V
2 V
Supply Voltage-Min (Vsup)
2.3 V
1.7 V
Supply Voltage-Nom (Vsup)
2.5 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
13 mm
13 mm
Base Number Matches
1
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare GS832132AD-250 with alternatives
Compare GS832132AD-150V with alternatives