GS8182S18BD-250T
vs
CY7C1393BV18-278BZXI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
End Of Life
Obsolete
Ihs Manufacturer
GSI TECHNOLOGY
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
LBGA,
13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
Pin Count
165
165
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
0.45 ns
0.45 ns
Additional Feature
PIPELINED ARCHITECTURE
PIPELINED ARCHITECTURE
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
JESD-609 Code
e0
e1
Length
15 mm
15 mm
Memory Density
18874368 bit
18874368 bit
Memory IC Type
DDR SRAM
DDR SRAM
Memory Width
18
18
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
1MX18
1MX18
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.4 mm
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
13 mm
13 mm
Base Number Matches
1
1
Clock Frequency-Max (fCLK)
278 MHz
I/O Type
SEPARATE
Moisture Sensitivity Level
3
Output Characteristics
3-STATE
Package Equivalence Code
BGA165,11X15,40
Peak Reflow Temperature (Cel)
260
Standby Current-Max
0.25 A
Standby Voltage-Min
1.7 V
Supply Current-Max
0.58 mA
Time@Peak Reflow Temperature-Max (s)
20
Compare GS8182S18BD-250T with alternatives
Compare CY7C1393BV18-278BZXI with alternatives