GS8182D36BD-375MT
vs
GS8161E36DGT-333V
feature comparison
All Stats
Differences Only
Part Life Cycle Code
End Of Life
Active
Ihs Manufacturer
GSI TECHNOLOGY
GSI TECHNOLOGY
Part Package Code
BGA
QFP
Package Description
LBGA,
QFP,
Pin Count
165
100
Reach Compliance Code
compliant
compliant
ECCN Code
3A001.A.2.C
3A991.B.2.B
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
0.45 ns
5 ns
Additional Feature
PIPELINED ARCHITECTURE
FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 2.5V
JESD-30 Code
R-PBGA-B165
R-PQFP-G100
Length
15 mm
Memory Density
18874368 bit
18874368 bit
Memory IC Type
QDR SRAM
CACHE SRAM
Memory Width
36
36
Number of Functions
1
1
Number of Terminals
165
100
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
512KX36
512KX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
QFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
1.4 mm
Supply Voltage-Max (Vsup)
1.9 V
2 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
Terminal Position
BOTTOM
QUAD
Width
13 mm
Base Number Matches
1
1
Rohs Code
Factory Lead Time
24 Weeks
Samacsys Manufacturer
GSI TECHNOLOGY
JESD-609 Code
e3
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Terminal Finish
Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare GS8182D36BD-375MT with alternatives
Compare GS8161E36DGT-333V with alternatives