GS8170DW72C-300IT
vs
GS8170DW72GC-300T
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
GSI TECHNOLOGY
GSI TECHNOLOGY
Part Package Code
BGA
BGA
Package Description
14 X 22 MM, 1 MM PITCH, BGA-209
LBGA,
Pin Count
209
209
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
1.8 ns
1.8 ns
Additional Feature
PIPELINED ARCHITECTURE
PIPELINED ARCHITECTURE
JESD-30 Code
R-PBGA-B209
R-PBGA-B209
Length
22 mm
22 mm
Memory Density
18874368 bit
18874368 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
72
72
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
209
209
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
256KX72
256KX72
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
220
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
1.7 mm
Supply Voltage-Max (Vsup)
1.95 V
1.95 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
14 mm
Base Number Matches
1
1
JESD-609 Code
e1
Terminal Finish
TIN SILVER COPPER
Compare GS8170DW72C-300IT with alternatives
Compare GS8170DW72GC-300T with alternatives