GS8162Z72C-250T
vs
GS8170DW72AC-333
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
GSI TECHNOLOGY
|
GSI TECHNOLOGY
|
Part Package Code |
BGA
|
BGA
|
Package Description |
14 X 22 MM, 1 MM PITCH, BGA-209
|
14 X 22 MM, 1 MM PITCH, BGA-209
|
Pin Count |
209
|
209
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.B
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
5.5 ns
|
1.8 ns
|
Additional Feature |
FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES WITH 3.3V SUPPLY
|
PIPELINED ARCHITECTURE
|
JESD-30 Code |
R-PBGA-B209
|
R-PBGA-B209
|
Length |
22 mm
|
22 mm
|
Memory Density |
18874368 bit
|
18874368 bit
|
Memory IC Type |
ZBT SRAM
|
STANDARD SRAM
|
Memory Width |
72
|
72
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
209
|
209
|
Number of Words |
262144 words
|
262144 words
|
Number of Words Code |
256000
|
256000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
256KX72
|
256KX72
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
220
|
220
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.7 mm
|
1.7 mm
|
Supply Voltage-Max (Vsup) |
2.7 V
|
1.95 V
|
Supply Voltage-Min (Vsup) |
2.3 V
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
14 mm
|
14 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
|
|
|
Compare GS8162Z72C-250T with alternatives
Compare GS8170DW72AC-333 with alternatives