GS816272CC-300MT vs GS8170LW72GC-300T feature comparison

GS816272CC-300MT GSI Technology

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GS8170LW72GC-300T GSI Technology

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer GSI TECHNOLOGY GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description LBGA, LBGA,
Pin Count 209 209
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 5 ns 1.8 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT 3.3V SUPPLY PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B209 R-PBGA-B209
Length 22 mm 22 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type CACHE SRAM STANDARD SRAM
Memory Width 72 72
Number of Functions 1 1
Number of Terminals 209 209
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 256KX72 256KX72
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max (Vsup) 2.7 V 1.95 V
Supply Voltage-Min (Vsup) 2.3 V 1.7 V
Supply Voltage-Nom (Vsup) 2.5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Terminal Finish TIN SILVER COPPER

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Compare GS8170LW72GC-300T with alternatives