GS8161E36GD-133I vs GS8161E36D-133 feature comparison

GS8161E36GD-133I GSI Technology

Buy Now Datasheet

GS8161E36D-133 GSI Technology

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GSI TECHNOLOGY GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description BGA, BGA, BGA165,11X15,40
Pin Count 165 165
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 8.5 ns 8.5 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e1 e0
Length 15 mm 15 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type CACHE SRAM CACHE SRAM
Memory Width 36 36
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512KX36 512KX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 235
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 2.7 V 2.7 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 13 mm
Base Number Matches 1 1
Clock Frequency-Max (fCLK) 133 MHz
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code BGA165,11X15,40
Standby Current-Max 0.02 A
Standby Voltage-Min 2.3 V
Supply Current-Max 0.17 mA

Compare GS8161E36GD-133I with alternatives

Compare GS8161E36D-133 with alternatives