GS8161E36DGT-333V vs GS8162Z18DD-250IT feature comparison

GS8161E36DGT-333V GSI Technology

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GS8162Z18DD-250IT GSI Technology

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Rohs Code Yes
Part Life Cycle Code Active Active
Ihs Manufacturer GSI TECHNOLOGY GSI TECHNOLOGY
Part Package Code QFP BGA
Package Description QFP, LBGA,
Pin Count 100 165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.B 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 24 Weeks
Samacsys Manufacturer GSI TECHNOLOGY
Access Time-Max 5 ns 5.5 ns
Additional Feature FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 2.5V FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY
JESD-30 Code R-PQFP-G100 R-PBGA-B165
Memory Density 18874368 bit 18874368 bit
Memory IC Type CACHE SRAM ZBT SRAM
Memory Width 36 18
Number of Functions 1 1
Number of Terminals 100 165
Number of Words 524288 words 1048576 words
Number of Words Code 512000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 512KX36 1MX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage-Max (Vsup) 2 V 2.7 V
Supply Voltage-Min (Vsup) 1.7 V 2.3 V
Supply Voltage-Nom (Vsup) 1.8 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form GULL WING BALL
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 1 1
Length 15 mm
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Terminal Pitch 1 mm
Width 13 mm

Compare GS8161E36DGT-333V with alternatives

Compare GS8162Z18DD-250IT with alternatives