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GS81302T37AGD-400I vs GS81302S36AGD-400IT feature comparison

GS81302T37AGD-400I GSI Technology

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GS81302S36AGD-400IT GSI Technology

Buy Now Datasheet
Part Life Cycle Code Active Active
Ihs Manufacturer GSI TECHNOLOGY GSI TECHNOLOGY
Package Description LBGA, BGA165,11X15,40 LBGA,
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.B 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 24 Weeks
Date Of Intro 2017-09-05
Access Time-Max 0.45 ns 0.45 ns
Additional Feature PIPE LINED ARCHITECTURE
Clock Frequency-Max (fCLK) 400 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B165 R-PBGA-B165
Length 15 mm 15 mm
Memory Density 150994944 bit 150994944 bit
Memory IC Type DDR SRAM DDR SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Ports 1
Number of Terminals 165 165
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Organization 4MX36 4MX36
Output Characteristics 3-STATE
Output Enable NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Reverse Pinout NO
Seated Height-Max 1.4 mm 1.4 mm
Standby Voltage-Min 1.7 V
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 13 mm
Base Number Matches 2 1
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Temperature Grade INDUSTRIAL
Memory » SRAMs
Memory » SRAMs

Compare GS81302T37AGD-400I with alternatives

Compare GS81302S36AGD-400IT with alternatives